Copper Cold Plate
Cold Plate

Copper Cold Plate

Coolant: Deionized water

Heat Source: Copper block with heat source area of 38mm × 38mm

Thermal interface material: Thermal grease with thermal conductivity of 6 W/m·K

Ambient temperature: 25°C

Flow rate: 3 LPM (Liters per Minute)

Contact Us
Introduction

Our cold plate is a high-efficiency heat sink made from copper or aluminum. With a high thermal conductivity coating, it can meet demanding cooling requirements of up to 2000W. The cold plate features internal flow channels that enable effective heat transfer, cooling the heat source and delivering excellent thermal performance for electronic devices. This significantly enhances equipment performance and is widely applicable in computers, servers, communication equipment, and other fields.


Features

High Thermal Conductivity: Excellent heat conduction properties allow rapid transfer of heat from electronic components to the cold plate, effectively reducing their operating temperature.

Efficient Heat Dissipation: Special structural design increases the surface area for heat dissipation, improving thermal efficiency. The surface of the cold plate is specially treated to enhance thermal conductivity and oxidation resistance.

Versatility: The cold plate features a simple and easy-to-install design. It can be customized according to user requirements, offering high flexibility and adaptability for various application scenarios.

High Reliability: Made from premium materials using advanced manufacturing techniques, the cold plate ensures long service life and stable performance, supporting reliable system operation.

Uniform Heat Distribution: High-performance cold plates maintain excellent thermal transfer efficiency while ensuring even heat distribution, reducing heat buildup and temperature gradients.

Parameter

Applicable CPU Socket

Length (mm)

Width (mm)

Height (mm)

Intel LGA2011

90

90

24

Intel LGA4677

118

78

24

Intel LGA4189

113

78

24

Intel LGA3647

108

78

24

AMD SP5

118

92.4

24

AMD SP3/SP6

119.3

78.9

24


Test results

Heat Load 

(W)

Inlet Water Temp

 (°C)

Flow Rate 

(LPM)

Heat Flux 

(W/cm2)

Surface Temp

(°C)

Thermal Resistance

 (°C/W)

600

24.7

3

41.55

46.02

0.0355

800

24.7

3

55.4

52.75

0.0351

1000

24.8

3

69.25

60.43

0.0356

1200

24.7

3

83.1

67.7

0.0358