Aluminum Cold Plate
Coolant: Deionized water
Heat Source: Copper block with heat source area of 38mm × 38mm
Thermal interface material: Thermal grease with thermal conductivity of 6 W/m·K
Ambient temperature: 25°C
Flow rate: 3 LPM (Liters per Minute)
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Our cold plate is a high-efficiency heat sink made from copper or aluminum. With a high thermal conductivity coating, it can meet demanding cooling requirements of up to 2000W. The cold plate features internal flow channels that enable effective heat transfer, cooling the heat source and delivering excellent thermal performance for electronic devices. This significantly enhances equipment performance and is widely applicable in computers, servers, communication equipment, and other fields.
Features
High Thermal Conductivity: Excellent heat conduction properties allow rapid transfer of heat from electronic components to the cold plate, effectively reducing their operating temperature.
Efficient Heat Dissipation: Special structural design increases the surface area for heat dissipation, improving thermal efficiency. The surface of the cold plate is specially treated to enhance thermal conductivity and oxidation resistance.
Versatility: The cold plate features a simple and easy-to-install design. It can be customized according to user requirements, offering high flexibility and adaptability for various application scenarios.
High Reliability: Made from premium materials using advanced manufacturing techniques, the cold plate ensures long service life and stable performance, supporting reliable system operation.
Uniform Heat Distribution: High-performance cold plates maintain excellent thermal transfer efficiency while ensuring even heat distribution, reducing heat buildup and temperature gradients.
Applicable CPU Socket | Length (mm) | Width (mm) | Height (mm) |
Intel LGA2011 | 90 | 90 | 28.5 |
Intel LGA4677 | 118 | 78 | 28.5 |
Intel LGA4189 | 113 | 78 | 28.5 |
Intel LGA3647 | 108 | 78 | 28.5 |
AMD SP5 | 118 | 92.4 | 28.5 |
AMD SP3/SP6 | 119.3 | 78.9 | 28.5 |
Heat Load (W) | Inlet Water Temp (°C) | Flow Rate (LPM) | Heat Flux (W/cm2) | Surface Temp (°C) | Thermal Resistance (°C/W) |
600 | 24.6 | 3 | 41.55 | 46.85 | 0.0371 |
800 | 24.8 | 3 | 55.4 | 53.45 | 0.0358 |
1000 | 24.9 | 3 | 69.25 | 61.02 | 0.0361 |
1200 | 24.8 | 3 | 83.1 | 67.88 | 0.0359 |