OSFP cold plate designed for high-density liquid cooling applications.

Micro-fin structure with 0.1 mm fin thickness and 0.1 mm fin pitch for efficient heat transfer.

Supports 0.9 LPM max flow rate and 150 PSI max pressure.

Allows ±0.5 mm misalignment tolerance for easier assembly.

Durable design supports up to 1,500 mating cycles.

Coolant: Deionized water

Heat Source: Aluminum block with heat source area of 38mm × 38mm

Thermal interface material: Thermal grease with thermal conductivity of 6 W/m·K

Ambient temperature: 25°C

Flow rate: 3 LPM (Liters per Minute)

Coolant: Deionized water

Heat Source: Copper block with heat source area of 38mm × 38mm

Thermal interface material: Thermal grease with thermal conductivity of 6 W/m·K

Ambient temperature: 25°C

Flow rate: 3 LPM (Liters per Minute)